Originally posted by ApBerg
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I use very conservative tracks and pads everywhere (typically 25mil for signals, 70mil for low-current power, 200mil for high-current) (Sorry, I learned all my drafting in the late 70s, and it's the one area I still can't metric-ise... I'm starting to have to for MCUs, they're nearly always in mm these days).
I drill all my single-sided stuff by hand too, so I know how important that is. You'll find that I use big round thick pads for passives, generally 60mil with 32mil holes, so after plating there's still a generous solder area and the leads don't get stuck or damage the plating. I'm really fussy about IC pads, power tracks, signal traces, and capacitive and inductive coupling, but that's from a TTL or CMOS digital perspective. It will be interesting to work with microvolts and picofarads making a difference!
And I always go overboard on mounting holes wherever I can get away with it. There's nothing worse than having to dig around for an insulating washer because some ******** has put components too close to the mounting hole. Or worse, the holes are too small and there's not enough annulus! I always create mounting holes to take M3 or M4 screws.
As far as grounding goes, I'm quite happy to do a VCC/GND plane fill for those who like that, or a GND/GND for the traditionalists, or a single GND plane, or none at all. Altium makes that stuff so simple it's ridiculous. As long as I remember which is which, of course!
I might put up a recent PCB design to show what I mean. I think I still have an old Rover design floating around on the big system. I'll dig it out and post it here so folks can see what I mean. That's probably better than just flapping my gums about how wonderful, intelligent, and handsome I am.

-Pete


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